It is a Halide / Halogen Free, Rosin / Resin Free, Low Solids, No-Clean Flux, with fine wetting properties. It is formulated for wave and Selective Soldering of through-hole, mixed technology and surface mount assemblies. The flux has been specifically developed to resist degradation in surface insulation resistance and electro migration, even in situations where the flux does not experience soldering temperatures and when heavy levels of flux have been applied. Particularly for touch-up/rework. ,this Flux is supplied in a flux pen.
Suitable for use on Cadmium, OSP, Tin, Copper, Gold, Zinc and Silver provided the surfaces are not heavily tarnished.
> Complies with Halide free standards. > Used for both Lead (Pb) free and Tin /Lead (Sn/Pb) free application. > High temperature stability, Less surface tension and High through hole penetration rate > The flux produces a tack-free surface with high surface insulation resistance with little residue to interfere with electrical testing. > The residue is non-corrosive and do not cause "greening" when in contact with copper or copper alloys. > Gives fine soldering in both single and dual wave soldering process with very safe residues. > Non-hygroscopic, Tack-free, non-Corrosive residues with Good Cosmetics. > No need to clean. > Good soldering in air; excellent soldering in nitrogen for low defects.
It is a Halide Free, No-Clean Flux, with fine wetting properties. This flux has been specifically developed to deliver high reliability and excellent soldering performance combined with outstanding Board Cosmetics and Pin-Testability..
Suitable for use on Cadmium, OSP, Tin, Copper, Gold, Zinc and Silver provided the surfaces are not heavily tarnished.Suitable to use where Lead (Pb) free or Tin /Lead (Sn/Pb) free Soldering applications done.
> Complies with Halide free standards. > Fine soldering in both single and dual wave soldering process. > High temperature stability, Less surface tension and High through hole penetration rate > Low tendency for Solder ball Generation in wide variety of solder masks during wave soldering and Selective soldering process. > Non-hygroscopic, Tack-free, non-Corrosive residues with Good Cosmetics. > No need to clean.
It is a Halide Free, No-Clean Flux, with fine wetting properties.
Suitable for use on Cadmium, OSP, Tin, Copper, Gold, Zinc and Silver provided the surfaces are not heavily tarnished.Suitable to use where Lead (Pb) free or Tin /Lead (Sn/Pb) free Soldering applications done.
> Complies with Halide free standards. > Fine soldering in both single and dual wave soldering process. > High temperature stability, Less surface tension and High through hole penetration rate > Low tendency for Solder ball Generation in wide variety of solder masks during wave soldering and Selective soldering process. > Non-hygroscopic, Tack-free, non-Corrosive residues with Good Cosmetics. > No need to clean.
SANCO PS 1002, which is a High Pure Solvent Cleaner is a blend of selective solvents including Glycol Ethers, Petroleum Distillates & Natural Terpenes that facilitates polymer removal. It is used for dissolving Urethanes, Rosins, Silicones, Anhydride-Cure Epoxies.
Used for Cleaning Application in PCBA, Conformal Coating Equipment and Printed circuit boards Assembly Process.
> Lead (Pb) free Product and meets Industrial Regulatory Requirements. > Has Higher Flash Point.& Categorized as non- hazardous (as per U.S. Department of Transportation) > Does not contain Phenols, Chlorinated Solvents, or Strong Acids / Bases. > It effectively removes Amine-Cured Epoxies or Polymers. > It is also used to cleaning applications of non-cured conformal coating
SANCO EN90 is a High Pure Material with Orange Flavor suitable for Electronic Circuit Board Cleaning Applications. This is an ideal replacement for Hand wipe or Immersion Mineral spirits.
It removes post soldered residues and other contaminants in PCBs during Assembly and can be used to clean off solder paste raw residues and other contaminants It is also used to cleaning applications of non-cured conformal coating.
> Lead (Pb) free Product and meets Industrial Regulatory Requirements. > With Orange Fragrance and Higher Flash Point., the products gives more comfort to Operators.. > An alternative to aqueous cleaning system and meets ionic cleanliness standards. > Cost Effective Cleaning Solution > Suitable for use on Cadmium, OSP, Tin, Copper, Gold, Zinc and Silver metal surfaces, provided the surfaces are not heavily tarnished.
It is a High Pure Material with Orange Flavor suitable for Electronic Circuit Board Cleaning Applications. This is an ideal replacement for Hand wipe or Immersion Mineral spirits.
It removes post soldered residues and other contaminants in PCBs during Assembly and can be used to clean off solder paste raw residues and other contaminants It is also used to cleaning applications of non-cured conformal coating.
> Lead (Pb) free Product and meets Industrial Regulatory Requirements. > With Orange Fragrance and Higher Flash Point., the products gives more comfort to Operators.. > An alternative to aqueous cleaning system and meets ionic cleanliness standards. > Cost Effective Cleaning Solution > Suitable for use on Cadmium, OSP, Tin, Copper, Gold, Zinc and Silver metal surfaces, provided the surfaces are not heavily tarnished.
S1003T is a High Pure Material with Orange Flavor suitable for Electronic Circuit Board Cleaning Applications. This is an ideal replacement for Hand wipe or Immersion Mineral spirits.
It removes post soldered residues and other contaminants in PCBs during Assembly and can be used to clean off solder paste raw residues and other contaminants It is also used to cleaning applications of non-cured conformal coating.
> Lead (Pb) free Product and meets Industrial Regulatory Requirements. > With Orange Fragrance and Higher Flash Point., the products gives more comfort to Operators.. > An alternative to aqueous cleaning system and meets ionic cleanliness standards. > Cost Effective Cleaning Solution > Suitable for use on Cadmium, OSP, Tin, Copper, Gold, Zinc and Silver metal surfaces, provided the surfaces are not heavily tarnished.
The Product is a Halogen and Halide Free Water Based Concentrated Cleaner. Formulated to remove the No-clean and Water- Soluble Flux residues from Pb free and Sn/Pb free PCB and PCBA
Suitable for use on Cadmium, OSP, Tin, Copper, Gold, Zinc and Silver metal surfaces, provided the surfaces are not heavily tarnished. This product can be used multiple times adding small amount of concentrated cleaner during cleaning process.
> Non-hygroscopic, Tack-free, non-Corrosive residues with Good Cosmetics. > Can get Zero Ion PCB & BCBA > With Concentrated cleaner 1 : 4 - 7 (Water) ratios can be mixed with DI or Drinking water to get good results in manual, ultrasonic or conveyorized cleaning methods. > Best alternative for solvent cleaning process and meets Ionic cleanliness standards in Pb free and Sn/Pb process. > Cost Effective Cleaning Solution
With Orange Fragrance, Sanco IPA (lso Propyl Alcohol) is a high pure material which can be used for Cleaning Applications. This is an ideal replacement for hand wipe or immersion mineral spirits
It removes effectively post soldered residues and other contaminants in printed circuit boards during assembly and can be used to clean off solder paste raw residues and other contaminants..
> Lead (Pb) free Product and meets Industrial Regulatory Requirements. > With Orange Fragrance and Higher Flash Point., the products gives more comfort to Operators.. > An alternative to aqueous cleaning system and meets ionic cleanliness standards. > Cost Effective Cleaning Solution > Suitable for use on Cadmium, OSP, Tin, Copper, Gold, Zinc and Silver metal surfaces, provided the surfaces are not heavily tarnished.
SANCO DRP 009 is a Unique Material which gives Complete Solutions to your Dross Problem The Product comes in a Crystalline White, Odorless Powder which is very easy to use.
Can be effectively used till Temperature ranging to 280°C.Can be used on Pb or Pb Free Alloys.
> Chemically reduces Dross on solder bath releasing useful solder back to the bath. > The oxides / residues floats on the surface for easy removal. > Does not affect the solder or the solderability. Test and field results show up to 80% of solder is recoverable. > Meets the Pb free and other regulatory requirements